Visual & Mechanical Examination

After the Pre-Cap inspection, the devices are visually and mechanically inspected per MIL-STD-1285, method 1 for marking in accordance with MIL-PRF-55310.

Microscope examination is performed per MIL-STD-883, Method 2017 and 2032. Magnification levels are from 10X to 60X.

Constant Acceleration

This test determines the effects of types of structural and or mechanical weaknesses that may not have been detected in

Frequency Aging

This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a

Mechanical Shock Testing

Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which

Powered Burn-In Testing

Powered burn-in testing screens for and eliminates marginal devices, those with inherent defects or defects resulting from manufacturing weaknesses which

Seal Testing

In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak

Sine Vibration Testing

Swept Sine Vibration testing determines the effect of high-frequency vibration on component parts in the frequency range of 10 to

Solderability & Resistance to Soldering Heat

This test performed in accordance with MIL-STD-202, Method 208 and resistance to solder heat per MIL-STD-202, Method 210,Test Condition C.

Stabilization Bake

The purpose of stabilization bake is to determine the effect on the device storage at elevated temperatures without electrical stress

Temperature Cycling / Thermal Shock

This test proves the resistance of a device to extreme high and low temperatures. PDI uses Blue-M Thermal Shock ovens,