Temperature Cycling / Thermal Shock

Optical comparator used for Mechanical inspection

This test proves the resistance of a device to extreme high and low temperatures.

PDI uses Blue-M Thermal Shock ovens, Model WAP-109-D with full data capture. Tests are compliant to MIL-STD-202, method 107. Typical tests can be 1000 cycles of temperature shock for a total of 100 hours with a low temperature of -65oC and a high of +150oC with each cycle held for 15 minutes between the extremes with a transfer time of 15 minutes.

When this testing is complete, devices are removed and electrically tested to search out any failures.

Constant Acceleration

This test determines the effects of types of structural and or mechanical weaknesses that may not have been detected in

Frequency Aging

This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a

Mechanical Shock Testing

Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which

Powered Burn-In Testing

Powered burn-in testing screens for and eliminates marginal devices, those with inherent defects or defects resulting from manufacturing weaknesses which

Seal Testing

In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak

Solder-ability & Resistance to Soldering Heat

This test performed in accordance with MIL-STD-202, Method 208 and resistance to solder heat per MIL-STD-202, Method 210,Test Condition C.

Stabilization Bake

The purpose of stabilization bake is to determine the effect on the device storage at elevated temperatures without electrical stress

Swept Sine Vibration Testing

Swept Sine Vibration testing determines the effect of high-frequency vibration on component parts in the frequency range of 10 to