Stabilization Bake

High temperature Aging, Temperature storage chamber

The purpose of stabilization bake is to determine the effect on the device storage at elevated temperatures without electrical stress applied.

Devices are placed into the Blue-M, Model CC-041-P-B-HP Environmental Chamber and subjected to 24 hours of dwell time at +150OC per MIL-STD-883, method 1008, Condition C.

Constant Acceleration

This test determines the effects of types of structural and or mechanical weaknesses that may not have been detected in

Frequency Aging

This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a

Mechanical Shock Testing

Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which

Powered Burn-In Testing

Powered burn-in testing screens for and eliminates marginal devices, those with inherent defects or defects resulting from manufacturing weaknesses which

Seal Testing

In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak

Solder-ability & Resistance to Soldering Heat

This test performed in accordance with MIL-STD-202, Method 208 and resistance to solder heat per MIL-STD-202, Method 210,Test Condition C.