Solder-ability & Resistance to Soldering Heat

Ambient pressure, High altitude, Vacuum, Temperature-Vacuum

This test performed in accordance with MIL-STD-202, Method 208 and resistance to solder heat per MIL-STD-202, Method 210,Test Condition C.

The terminals are exposed to a solder bath of 350o F, at an immersion angle of 90o. The devices are then held in the solder bath for a period of five (5) to ten (10) seconds. The solder is applied to either ¼ inch from the nearest insulating material of the component or ½ of the exposed length of the terminal (which ever is closer). This test verifies that pre-assembly lead finish provides a solderable surface and sufficient quality to make an acceptable solder joint.

By passing, it proves that the device can withstand the heat applied during the solder operation.

Constant Acceleration

This test determines the effects of types of structural and or mechanical weaknesses that may not have been detected in

Frequency Aging

This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a

Mechanical Shock Testing

Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which

Powered Burn-In Testing

Powered burn-in testing screens for and eliminates marginal devices, those with inherent defects or defects resulting from manufacturing weaknesses which

Seal Testing

In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak