Seal Testing

In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak (Grade 5 helium tracer gas) testing is performed. Seal tests are performed in accordance with MIL-STD-883, method 1014, conditions C and D.

Gross leak detection is performed with an Intertest Bubble Detector, model 1014-CBL (Top right) which is followed with a fine leak detection using a Varian Leak Detector, model 959-50 (Bottom right).

Gross leak testing is done with the devices immersed at a depth of 2 inches over a 3 minute period examined by a 3X magnifying window. Fine leak testing is performed for periods up to 60 minutes pressurized @ 60psi.

Constant Acceleration

This test determines the effects of types of structural and or mechanical weaknesses that may not have been detected in

Frequency Aging

This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a

Mechanical Shock Testing

Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which

Powered Burn-In Testing

Powered burn-in testing screens for and eliminates marginal devices, those with inherent defects or defects resulting from manufacturing weaknesses which

Seal Testing

In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak

Sine Vibration Testing

Swept Sine Vibration testing determines the effect of high-frequency vibration on component parts in the frequency range of 10 to

Solderability & Resistance to Soldering Heat

This test performed in accordance with MIL-STD-202, Method 208 and resistance to solder heat per MIL-STD-202, Method 210,Test Condition C.

Stabilization Bake

The purpose of stabilization bake is to determine the effect on the device storage at elevated temperatures without electrical stress

Temperature Cycling / Thermal Shock

This test proves the resistance of a device to extreme high and low temperatures. PDI uses Blue-M Thermal Shock ovens,

Visual & Mechanical Examination

After the Pre-Cap inspection, the devices are visually and mechanically inspected per MIL-STD-1285, method 1 for marking in accordance with

MIL-PRF-38534 Hybrid Microcircuit Certified

DSCC Laboratory Suitability Certified

MIL-STD-790 Product Assurance Certified

ISO 9001:2008 FM 75597

REACH Compliance Certified

EMS 80740

Seal Testing

Constant Acceleration

Frequency Aging

Mechanical Shock Testing

Powered Burn-In Testing

Seal Testing

Sine Vibration Testing

Solderability & Resistance to Soldering Heat

Stabilization Bake

Temperature Cycling / Thermal Shock

Visual & Mechanical Examination

Avrio Technology Group, LLC