Mechanical Shock Testing

MECHANICALSHOCKTESTING2 Mechanical Shock Testing

Mechanical Shock Testing

Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation.

Shocks of this type may disturb operating characteristics or cause damage similar to that resulting from excessive vibration.

Devices are tested to MIL-STS-202, Method 213B and are typically subjected to three saw tooth pulses with an amplitude of 100 g’s for five to six milliseconds in each axis direction. After testing, the devices are visually and electrically tested after testing to look for failures.

Constant Acceleration

Constant Acceleration

This test determines the effects of types of structural and or mechanical weaknesses that may not have been detected in

Frequency Aging

Frequency Aging

This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a

Mechanical Shock Testing

Mechanical Shock Testing

Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which

Powered Burn-In Testing

Powered Burn-In Testing

Powered burn-in testing screens for and eliminates marginal devices, those with inherent defects or defects resulting from manufacturing weaknesses which

Seal Testing

Seal Testing

In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak

Solder-ability & Resistance to Soldering Heat

Solder-ability & Resistance to Soldering Heat

This test performed in accordance with MIL-STD-202, Method 208 and resistance to solder heat per MIL-STD-202, Method 210,Test Condition C.

Stabilization Bake

Stabilization Bake

The purpose of stabilization bake is to determine the effect on the device storage at elevated temperatures without electrical stress

Swept Sine Vibration Testing

Swept Sine Vibration Testing

Swept Sine Vibration testing determines the effect of high-frequency vibration on component parts in the frequency range of 10 to

Temperature Cycling / Thermal Shock

Temperature Cycling / Thermal Shock

This test proves the resistance of a device to extreme high and low temperatures. PDI uses Blue-M Thermal Shock ovens,

Visual & Mechanical Examination

Visual & Mechanical Examination

After the Pre-Cap inspection, the devices are visually and mechanically inspected per MIL-STD-1285, method 1 for marking in accordance with

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