MIL-PRF-38534 Hybrid Microcircuit Certified

MIL-PRF-38534 Hybrid Microcircuit Certified

DSCC Laboratory Suitability Certified

DSCC Laboratory Suitability Certified

MIL-STD-790 Product Assurance Certified

MIL-STD-790 Product Assurance Certified

ISO 9001:2008 FM 75597

ISO 9001:2008 FM 75597

REACH Compliance Certified

REACH Compliance Certified

EMS 80740

EMS 80740



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PDI with our profile on RF Globalnet

Frequency Aging

PDI Services Frequency Aging big Frequency Aging

Frequency Aging


This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a given period of time.

Data is collected at specified intervals (every 72 hours is typical) and such tests can take up to 30 days (720 hours).

Constant Acceleration

Constant Acceleration

This test determines the effects of types of structural and or mechanical weaknesses that may not have been detected in

Frequency Aging

Frequency Aging

This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a

Mechanical Shock Testing

Mechanical Shock Testing

Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which

Powered Burn-In Testing

Powered Burn-In Testing

Powered burn-in testing screens for and eliminates marginal devices, those with inherent defects or defects resulting from manufacturing weaknesses which

Seal Testing

Seal Testing

In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak

Sine Vibration Testing

Sine Vibration Testing

Swept Sine Vibration testing determines the effect of high-frequency vibration on component parts in the frequency range of 10 to

Solderability & Resistance to Soldering Heat

Solderability & Resistance to Soldering Heat

This test performed in accordance with MIL-STD-202, Method 208 and resistance to solder heat per MIL-STD-202, Method 210,Test Condition C.

Stabilization Bake

Stabilization Bake

The purpose of stabilization bake is to determine the effect on the device storage at elevated temperatures without electrical stress

Temperature Cycling / Thermal Shock

Temperature Cycling / Thermal Shock

This test proves the resistance of a device to extreme high and low temperatures. PDI uses Blue-M Thermal Shock ovens,

Visual & Mechanical Examination

Visual & Mechanical Examination

After the Pre-Cap inspection, the devices are visually and mechanically inspected per MIL-STD-1285, method 1 for marking in accordance with

Avrio Technology Group, LLC

Avrio Technology