Testing Services
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This test determines the effects of types of structural and or mechanical weaknesses that may not have been detected in
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This test is performed to demonstrate the quality and reliability of devices that are subjected to specific conditions over a
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Mechanical Shock testing of the devices X-Y axis determines the suitability of the devices for use in electronic equipment which
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Powered burn-in testing screens for and eliminates marginal devices, those with inherent defects or defects resulting from manufacturing weaknesses which
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In order to determine the effectiveness (hermeticity) of the seal on the device, both gross (Fluorocarbon liquid) and fine leak
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Swept Sine Vibration testing determines the effect of high-frequency vibration on component parts in the frequency range of 10 to
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Solderability & Resistance to Soldering Heat
This test performed in accordance with MIL-STD-202, Method 208 and resistance to solder heat per MIL-STD-202, Method 210,Test Condition C.
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The purpose of stabilization bake is to determine the effect on the device storage at elevated temperatures without electrical stress
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Temperature Cycling / Thermal Shock
This test proves the resistance of a device to extreme high and low temperatures. PDI uses Blue-M Thermal Shock ovens,
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Visual & Mechanical Examination
After the Pre-Cap inspection, the devices are visually and mechanically inspected per MIL-STD-1285, method 1 for marking in accordance with
